Rationalized automatic production line configuration and high-precision equipment configuration are conducive to ensuring the quality of produced products.
According to the type of customer's product, selecting the appropriate production line for corresponding production is conducive to reducing production costs.
Using the least personnel and optimized engineering design, it can respond to changes in the number of customer orders at any time.
When dealing with customer complaints, it has a complete response mechanism and rapid processing capability.
High Quality And Efficiency
| Items | Capability | Items | Capability | |
|---|---|---|---|---|
| Template | Batch | Material | FR4 / Hi-Tg / Rogers / Halogen Free / RCC PTFE / Nelco / Mixed lamination Materials | |
| Number of Layers | 2-64 L | 2-58 L | ||
| Board Thickness | 0.5-17.5mm | 0.6-10mm | Surface Treatment | HASL、HASL PB FREE Immersion Gold/Tin/Silver Gold Finger Plating OSP、Immersion Gold + OSP |
| Drill Sizes - Min | 0.1mm | 0.2mm | ||
| Annular Ring - Min | 3mil | 4mil | ||
| HDI Type | 1+n+1 \ 2+n+2 3+n+3 | 1+n+1 \ 2+n+2 | Other Techniques | Blind and Buried Vias / Step groove / metal substrate / embedded resistor / embedded capacitor / mixed pressure / soft and hard combination / back drill / step gold finger |
| Spacing/Tracing - Min | 3/3mil | 4/4mil | ||
| Maximum Layer Copper Thickness | 12oz | 6oz | ||
| Maximum Plate Thickness Aperture Ratio | 18:1 | 16:1 | PCBA Capacity | 31.5 million Solder SXINEN/day |
| Maximum PCB Size | 650mm X 1130mm | 610mm X 1100mm | PCBA Production line | 30Article |
| Impedance Control | +/-5% | +/-10% | ||
PCB Assembly
PCB Fabrication